公开(公告)号：US11946523B2

公开(公告)日：2024-04-02

申请号：US16965851

申请日：2018-10-17

申请人： THE HONG KONG POLYTECHNIC UNIVERSITY

发明人： Li Cheng ,  Tong Zhou

IPC分类号： F16F7/10 ,  G10K11/168

CPC分类号： F16F7/10 ,  G10K11/168 ,  F16F2222/08 ,  F16F2226/04 ,  F16F2226/042 ,  F16F2226/048 ,  F16F2228/007 ,  F16F2228/04 ,  F16F2230/18 ,  F16F2234/00

摘要： A wideband vibration suppression device utilizing properties of a sonic black hole, comprising: a vibration absorber (101) comprising a uniform portion (1011) of a fixed thickness and a conical portion (1012) integrally connected to the uniform portion (1011), the conical portion (1012) extending from the junction in such a manner that the thickness thereof gradually decreases from the thickness (d1) of the uniform portion (1011) to a predetermined thickness (d2); and a damping layer (102) attached to the conical portion (1012) of the vibration absorber (101).