IMPLANTS USING ULTRASONIC BACKSCATTER FOR SENSING ELECTRICAL IMPEDANCE OF TISSUE

    公开(公告)号:US20190150882A1

    公开(公告)日:2019-05-23

    申请号:US16313860

    申请日:2017-07-07

    Abstract: Described herein is an implantable device configured to detect impedance characteristic of a tissue. In certain exemplary devices, the implantable device comprises (a) an ultrasonic transducer configured to emit an ultrasonic backscatter encoding information relating to an impedance characteristic of a tissue based on a modulated current flowing through the ultrasonic transducer; (b) an integrated circuit comprising (i) a variable frequency power supply electrically connected to a first electrode and a second electrode; (ii) a signal detector configured to detect an impedance, voltage, or current in a circuit comprising the variable frequency power supply, the first electrode, the second electrode, and the tissue; and (iii) a modulation circuit configured to modulate the current flowing through the ultrasonic transducer based on the detected impedance, voltage, or current; and the first electrode and the second electrode configured to be implanted into the tissue in electrical connection with each other through the tissue. Further described are systems including one or more implantable devices and an interrogator for operating the implantable device, methods of measuring impedance characteristic of a tissue in a subject, and methods of monitoring or characterizing a tissue in a subject.

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