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公开(公告)号：US11543465B2
公开(公告)日：2023-01-03
申请号：US16841323
申请日：2020-04-06
发明人： Scott Green , Yogesh B. Gianchandani , Richard Kwon , Grace Elta , Jiqing Jiang , Ramprasad Nambisan
摘要： Encapsulation packages for stent-deployable monitoring devices formed of resonator sensors and allowing for magnetic biasing elements that exhibit a targeted impact on the mechanical characteristics of a stent are provided. Encapsulation packages are formed of different types and include a longitudinal shield and curved end on profile for aligning the shield within the deployable stent, the shield having perforations such that a resonator can be positioned adjacent the perforations for allowing particulate within the stent to collect and be measured by the resonator during deployment.
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公开(公告)号：US20200319268A1
公开(公告)日：2020-10-08
申请号：US16841323
申请日：2020-04-06
发明人： Scott Green , Yogesh B. Gianchandani , Richard Kwon , Grace Elta , Jiqing Jiang , Ramprasad Nambisan
摘要： Encapsulation packages for stent-deployable monitoring devices formed of resonator sensors and allowing for magnetic biasing elements that exhibit a targeted impact on the mechanical characteristics of a stent are provided. Encapsulation packages are formed of different types and include a longitudinal shield and curved end on profile for aligning the shield within the deployable stent, the shield having perforations such that a resonator can be positioned adjacent the perforations for allowing particulate within the stent to collect and be measured by the resonator during deployment.
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