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公开(公告)号:US20220016310A1
公开(公告)日:2022-01-20
申请号:US17395116
申请日:2021-08-05
Applicant: THE TEXAS A&M UNIVERSITY SYSTEM
Inventor: Mary Beth Monroe , Duncan J. Maitland , Andrew Weems , Brandis Keller , Grace Fletcher
IPC: A61L24/00 , A61L24/04 , C08G18/10 , C08G18/73 , C08G18/83 , C08J9/36 , A61L15/26 , A61L27/50 , A61L31/14 , A61L31/16 , A61L15/46 , A61L27/18 , A61L27/56 , A61L15/42 , A61L31/06 , A61L27/54
Abstract: An embodiment includes a system comprising a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent. The antimicrobial agent may include at least one phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the SMP foam. Other embodiments are described herein.
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公开(公告)号:US11090408B2
公开(公告)日:2021-08-17
申请号:US16466073
申请日:2017-12-06
Applicant: THE TEXAS A&M UNIVERSITY SYSTEM
Inventor: Mary Beth Monroe , Duncan J. Maitland , Andrew Weems , Brandis Keller , Grace Fletcher
IPC: A61L24/00 , A61L24/04 , C08G18/10 , C08G18/73 , C08G18/83 , C08J9/36 , A61L15/26 , A61L27/50 , A61L31/14 , A61L31/16 , A61L15/46 , A61L27/18 , A61L27/56 , A61L15/42 , A61L31/06 , A61L27/54
Abstract: An embodiment includes a system comprising a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent. The antimicrobial agent may include at least one phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the SMP foam. Other embodiments are described herein.
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公开(公告)号:US20190282726A1
公开(公告)日:2019-09-19
申请号:US16466073
申请日:2017-12-06
Applicant: THE TEXAS A&M UNIVERSITY SYSTEM
Inventor: Mary Beth Monroe , Duncan J. Maitland , Andrew Weems , Brandis Keller , Grace Fletcher
Abstract: An embodiment includes a system comprising a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent. The antimicrobial agent may include at least one phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the SMP foam. Other embodiments are described herein.
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