公开(公告)号：US20230411347A1

公开(公告)日：2023-12-21

申请号：US18267492

申请日：2021-12-14

申请人： THE UNIVERSITY OF HONG KONG

发明人： Mingxin Huang ,  Shien Ping Feng

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L24/13 ,  H01L2224/83203 ,  H01L2924/01029 ,  H01L2224/13147 ,  H01L2224/29147 ,  H01L2224/8309

摘要： Disclosed is a method of bonding two copper structures involving compressing a first copper structure with a second copper structure under a stress from 0.1 MPa to 50 MPa and under a temperature of 250° C. or less so that a bonding surface of the first copper structure is bonded to a bonding surface of the second copper structure; at least one of the bonding surface of the first copper structure and the bonding surface of the second copper structure have a layer of nanograins of copper having an average grain size of 5 nm to 500 nm, the layer of the nanograins of copper having a thickness of 10 nm to 10 μm.

公开(公告)号：US20240099037A1

公开(公告)日：2024-03-21

申请号：US18272356

申请日：2022-01-27

申请人： THE UNIVERSITY OF HONG KONG

发明人： Shien Ping Feng ,  Wei Ting Wang

IPC分类号： H10K30/50 ,  C07C333/20 ,  H10K85/50 ,  H10K85/60

CPC分类号： H10K30/50 ,  C07C333/20 ,  H10K85/50 ,  H10K85/60

摘要： Disclosed is a passivated perovskite structure containing a perovskite layer; and a hindered urea bond-based Lewis acid-base containing layer adjacent the perovskite layer. Also disclosed are solar cells containing the passivated perovskite structure.