公开(公告)号：US20210057243A1

公开(公告)日：2021-02-25

申请号：US16999024

申请日：2020-08-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Suguru MOTEGI ,  Takashi KUMAGAI ,  Akira KODASHIMA ,  Keisuke YOSHIMURA

IPC: H01L21/67 ,  H01J37/32

Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

公开(公告)号：US20230015560A1

公开(公告)日：2023-01-19

申请号：US17956214

申请日：2022-09-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Suguru MOTEGI ,  Takashi KUMAGAI ,  Akira KODASHIMA ,  Keisuke YOSHIMURA

IPC: H01L21/67 ,  H01J37/32

Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

公开(公告)号：US20210043480A1

公开(公告)日：2021-02-11

申请号：US16984520

申请日：2020-08-04

Applicant: TOKYO ELECTRON LIMITED

Inventor： Suguru MOTEGI ,  Takashi KUMAGAI ,  Akira KODASHIMA

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing system includes a first chamber, a second chamber, and a cooling passage. The first chamber has therein a space for processing a substrate transferred from a first transfer chamber maintained in a vacuum atmosphere. The second chamber is disposed below the first chamber to be vertically aligned with the first chamber and configured to communicate with the first transfer chamber and a second transfer chamber maintained in an atmospheric atmosphere. The second chamber has substantially the same footprint as a footprint of the first chamber. Further, a cooling passage is disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough.