公开(公告)号：US20200152453A1

公开(公告)日：2020-05-14

申请号：US16681634

申请日：2019-11-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Corey LEMLEY ,  Richard Farrell ,  Hoyoung Kang

IPC: H01L21/02 ,  C23C16/455 ,  C23C16/04

Abstract: Methods for processing a substrate are provided. The method includes receiving a substrate. The substrate has a front side surface, a backside surface, and a side edge surface. The method also includes coating the front side surface, the backside surface and the side edge surface with a self-assembled monolayer and exposing an area of interest with actinic radiation. The actinic radiation causes a de-protection reaction within the self-assembled monolayer within the central region. The method also includes removing the self-assembled monolayer from the area of interest while the self-assembled monolayer remains on remaining surfaces of the substrate.