公开(公告)号：US10385453B2

公开(公告)日：2019-08-20

申请号：US15240316

申请日：2016-08-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masato Yonezawa ,  Shigehiro Miura ,  Hiroyuki Akama ,  Koji Yoshii

IPC: C23C16/52 ,  C23C16/46 ,  C23C16/455 ,  C23C16/458

Abstract: A film forming apparatus for performing a predetermined film forming process on a substrate mounted on an upper surface of a rotary table installed within a process vessel while rotating the rotary table and heating the substrate by a heating part, includes: a contact type first temperature measuring part configured to measure a temperature of the heating part; a non-contact type second temperature measuring part configured to measure a temperature of the substrate; and a control part configured to control a power supplied to the heating part based on at least one among a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part. The control part changes a method for controlling the power when the predetermined film forming process is performed on the substrate and when the substrate is loaded into or unloaded from the process vessel.