公开(公告)号：US10385453B2

公开(公告)日：2019-08-20

申请号：US15240316

申请日：2016-08-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masato Yonezawa ,  Shigehiro Miura ,  Hiroyuki Akama ,  Koji Yoshii

IPC: C23C16/52 ,  C23C16/46 ,  C23C16/455 ,  C23C16/458

Abstract: A film forming apparatus for performing a predetermined film forming process on a substrate mounted on an upper surface of a rotary table installed within a process vessel while rotating the rotary table and heating the substrate by a heating part, includes: a contact type first temperature measuring part configured to measure a temperature of the heating part; a non-contact type second temperature measuring part configured to measure a temperature of the substrate; and a control part configured to control a power supplied to the heating part based on at least one among a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part. The control part changes a method for controlling the power when the predetermined film forming process is performed on the substrate and when the substrate is loaded into or unloaded from the process vessel.

公开(公告)号：US20160293457A1

公开(公告)日：2016-10-06

申请号：US15082342

申请日：2016-03-28

Applicant: Tokyo Electron Limited

Inventor： Tatsuya Yamaguchi ,  Koji Yoshii ,  Masafumi Shoji

IPC: H01L21/67 ,  H01L21/324

CPC classification number: H01L21/67109 ,  H01L21/324 ,  H01L21/67248

Abstract: Disclosed is a heat treatment apparatus including: a heating unit that heats an inside of a processing chamber that accommodates a plurality of workpieces; a temperature drop rate model storing unit that stores a temperature drop rate model; and a heat treatment performing unit that sets the temperature drop rate model stored in the temperature drop model storing unit and sets the inside of the processing chamber to the temperature and the time represented in the temperature drop rate model. The temperature drop rate model storing unit stores a plurality of temperature drop rate models, each of which has a different temperature drop rate. The processing chamber is divided into a plurality of zones, and the temperature drop rate mode is set for each of the zones. The heat treatment performing unit sets different temperature drop rate models in a plurality of zones to heat the plurality of workpieces.

Abstract translation: 公开了一种热处理设备，包括：加热单元，其加热容纳多个工件的处理室的内部; 温度下降率模型存储单元，其存储温度降率模型; 以及热处理执行单元，其设定存储在温降模型存储单元中的温度下降率模型，并将处理室的内部设定为温度下降率模型中表示的温度和时间。 温度下降率模型存储单元存储多个具有不同温度下降率的温度降率模型。 处理室被分成多个区域，并且为每个区域设定温度降低模式。 热处理执行单元在多个区域中设置不同的温度下降率模型以加热多个工件。

公开(公告)号：US11815407B2

公开(公告)日：2023-11-14

申请号：US17007009

申请日：2020-08-31

Applicant: Tokyo Electron Limited ,  Furuya Metal Co., Ltd.

Inventor： Hisashi Inoue ,  Masahiro Kobayashi ,  Yasuaki Kikuchi ,  Tatsuya Yamaguchi ,  Koji Yoshii ,  Kensuke Morita ,  Jun Itabashi

IPC: G01K7/02 ,  G01K1/08 ,  H10N19/00

CPC classification number: G01K7/02 ,  G01K1/08 ,  H10N19/00

Abstract: A thermocouple structure according to one aspect of the present disclosure includes a first element wire, second element wires formed of a material different from the first element wire, an insulating covering member covering at least one of the first element wire and the second element wires, and a protective tube accommodating the first element wire and the second element wire. Each of the second element wires is bonded to a different position on the first element wire.

公开(公告)号：US20200168486A1

公开(公告)日：2020-05-28

申请号：US16690712

申请日：2019-11-21

Applicant: Tokyo Electron Limited

Inventor： Tatsuya Yamaguchi ,  Yasuaki Kikuchi ,  Koji Yoshii ,  Wataru Nakajima ,  Norio Baba

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/263

Abstract: A heat treatment apparatus includes a heating unit provided around a processing container accommodating a substrate; a plurality of blowing units configured to blow a cooling medium into a space between the processing container and the heating unit; and a shutter configured to simultaneously opens/closes at least two of the plurality of blowing units and including a slit formed corresponding to each of the blowing units.

公开(公告)号：US09748122B2

公开(公告)日：2017-08-29

申请号：US14270524

申请日：2014-05-06

Applicant: Tokyo Electron Limited

Inventor： Koji Yoshii ,  Tatsuya Yamaguchi ,  Wenling Wang ,  Takanori Saito

IPC: F27B5/14 ,  H05B1/02 ,  H01L21/67 ,  F27B17/00 ,  F27D19/00 ,  F27D21/00

CPC classification number: H01L21/67115 ,  F27B17/0025 ,  F27D19/00 ,  F27D21/0014 ,  H01L21/67109 ,  H01L21/67248

Abstract: A control unit can select a large-number control zone model in which the number of control zones, which are independently controlled, is large, and a small-number control zone model in which the number of control zones, which are independently controlled, is small. When a temperature is increased or decreased, the control unit can select the small-number control zone model so as to control, based on signals from temperature sensors of the respective control zones C1 . . . C5 whose number is small, heaters located on the respective control zones C1 . . . C5. When a temperature is stabilized, the control unit can select the large-number control zone model so as to control, based on signals signals from the temperature sensors of the respective control zones C1 . . . C10 whose number is large, the heaters located on the respective control zones C1 . . . C10.

公开(公告)号：US11114319B2

公开(公告)日：2021-09-07

申请号：US16690712

申请日：2019-11-21

Applicant: Tokyo Electron Limited

Inventor： Tatsuya Yamaguchi ,  Yasuaki Kikuchi ,  Koji Yoshii ,  Wataru Nakajima ,  Norio Baba

IPC: H01L21/67 ,  H01L21/263 ,  H01L21/66

Abstract: A heat treatment apparatus includes a heating unit provided around a processing container accommodating a substrate; a plurality of blowing units configured to blow a cooling medium into a space between the processing container and the heating unit; and a shutter configured to simultaneously opens/closes at least two of the plurality of blowing units and including a slit formed corresponding to each of the blowing units.

公开(公告)号：US10431479B2

公开(公告)日：2019-10-01

申请号：US15864299

申请日：2018-01-08

Applicant: Tokyo Electron Limited

Inventor： Tatsuya Yamaguchi ,  Kazuteru Obara ,  Yasuaki Kikuchi ,  Koji Yoshii

IPC: H01L21/67

Abstract: Disclosed is a heat treatment apparatus including: a processing container configured to accommodate a substrate; a furnace body having a heater configured to heat the substrate accommodated in the processing container and provided around the processing container; a blower configured to supply a coolant to a space between the processing container and the furnace body; and a controller having a continuous operation mode in which the blower is continuously energized and an intermittent operation mode in which energization and de-energization of the blower are repeated, and configured to control driving of the blower based on an instruction voltage. The controller drives the blower in the intermittent operation mode when the instruction voltage is higher than 0 V and lower than a predetermined threshold voltage.

公开(公告)号：US09207665B2

公开(公告)日：2015-12-08

申请号：US13742603

申请日：2013-01-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Goro Takahashi ,  Takahito Kasai ,  Takanori Saito ,  Wenling Wang ,  Koji Yoshii ,  Tatsuya Yamaguchi

IPC: G06F19/00 ,  G05B19/418 ,  H01L21/67

CPC classification number: G05B19/418 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248

Abstract: The heat treatment apparatus that increases a temperature of a processing object and performs a heat treatment in a constant temperature, the heat treatment apparatus includes: a processing chamber which accommodates the processing object; a heating unit which heats the processing object accommodated in the processing chamber; a memory unit which stores two or more temperature control models that are previously created, a temperature controller which controls a temperature of the heating unit; and an apparatus controller which controls the temperature controller and the memory unit, wherein the apparatus controller selects a temperature control model among the two or more temperature control models according to desired heat treatment conditions, and wherein the temperature controller reads out the selected temperature control model from the memory unit to control the heating unit.

Abstract translation: 所述热处理装置具有：处理室，其容纳所述处理对象物;处理对象物， 加热单元，其加热容纳在处理室中的处理对象; 存储单元，其存储先前创建的两个或更多个温度控制模型;温度控制器，其控制所述加热单元的温度; 以及控制所述温度控制器和所述存储单元的装置控制器，其中所述装置控制器根据期望的热处理条件在所述两个或更多温度控制模型中选择温度控制模型，并且其中所述温度控制器读出所选择的温度控制模型 从存储单元控制加热单元。

公开(公告)号：US11656126B2

公开(公告)日：2023-05-23

申请号：US16685047

申请日：2019-11-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kazuteru Obara ,  Koji Yoshii ,  Yuki Wada ,  Hitoshi Kikuchi

IPC: C23C16/52 ,  G01J5/00 ,  C23C16/40 ,  C23C16/46 ,  C23C16/458 ,  C23C16/455 ,  H01L21/02 ,  H01L21/687 ,  G05D23/19 ,  H01L21/67 ,  G02B26/12 ,  G01J5/07

CPC classification number: G01J5/0007 ,  C23C16/402 ,  C23C16/4584 ,  C23C16/45551 ,  C23C16/46 ,  C23C16/52 ,  G01J5/07 ,  G02B26/12 ,  G05D23/1931 ,  H01L21/0228 ,  H01L21/02164 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/68771

Abstract: There is provided a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed in a processing vessel and heating the substrate by a heating part while rotating the rotary table. The heat treatment apparatus includes: a first temperature measuring part of a contact-type configured to measure a temperature of the heating part; a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and a temperature control part configured to control the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.

公开(公告)号：US11424143B2

公开(公告)日：2022-08-23

申请号：US16297858

申请日：2019-03-11

Applicant: Tokyo Electron Limited

Inventor： Koji Yoshii ,  Tatsuya Yamaguchi ,  Hiroyuki Hayashi ,  Mitsuhiro Okada ,  Satoshi Takagi ,  Toshihiko Takahashi ,  Masafumi Shoji ,  Kazuya Kitamura

IPC: H01L21/67 ,  H01L21/673

Abstract: Provided is a heat insulation structure used for a vertical heat treatment apparatus that performs a heat treatment on a substrate. The vertical heat treatment apparatus includes: a processing container having a double tube structure including an inner tube and an outer tube closed upward, the processing container having an opening at a lower end thereof; a gas supply section and exhaust section provided on a lower side of the processing container; a lid configured to introduce or discharge the substrate into or from the opening and to open/close the opening; and a heating section provided to cover the processing container from an outside. The heat insulation structure is provided between the inner tube and the outer tube.