公开(公告)号：US20200208267A1

公开(公告)日：2020-07-02

申请号：US16726369

申请日：2019-12-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takashi KAMIO ,  Tetsuya SAITOU ,  Kai SHIONO

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/06

Abstract: A film-forming apparatus includes a processing container having a vacuum atmosphere therein, a stage having a heater and disposed in the processing container to load a substrate thereon, a gas discharge mechanism provided at a position to face the stage, and an exhaust part configured to exhaust an inside of the processing container. The gas discharge mechanism includes a gas intake port configured to introduce a processing gas into the processing container, a first plate-shaped member having a first opening formed in a more radially outward position than the gas intake port and a shower plate disposed between the first plate-shaped member and the stage to supply the processing gas from the first opening to a process space through a plurality of gas holes.