公开(公告)号：US11094568B2

公开(公告)日：2021-08-17

申请号：US15960800

申请日：2018-04-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji Nakamizo ,  Satoshi Morita ,  Akinori Tanaka ,  Hiroshi Komiya ,  Mikio Nakashima ,  Kousuke Fukuda ,  Youichi Masaki ,  Ryoji Ando ,  Ikuo Sunaka

IPC: H01L21/67 ,  G01F9/00 ,  G01M3/28 ,  G01F25/00 ,  G05B23/02 ,  G01F15/00

Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.