公开(公告)号：US20230197475A1

公开(公告)日：2023-06-22

申请号：US18084063

申请日：2022-12-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Teruhiko KODAMA ,  Yuzo OHISHI ,  Yoshitaka MATSUDA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67115 ,  H01L21/67778 ,  H01L21/67796 ,  H01L21/68742

Abstract: A substrate processing apparatus includes: a substrate holder configured to hold a substrate while being locally superimposed on a back surface of the substrate; a light irradiator configured to irradiate the back surface with light so as to remove an organic substance on the back surface of the substrate; a light shielding member provided at a back side of the substrate while being spaced apart from the back surface so as to prevent the light from being supplied to a front surface of the substrate; and a holding position changing mechanism configured to change a holding position by the substrate holder on the back surface of the substrate so as to irradiate the entire back surface of the substrate with the light.