公开(公告)号：US20250083421A1

公开(公告)日：2025-03-13

申请号：US18960916

申请日：2024-11-26

Applicant: TOPPAN INC.

Inventor： Kazuyuki YAMASHITA ,  Eiichi KANAUMI ,  Akiharu MIYANAGA

IPC: B32B27/00 ,  C09K11/02 ,  H01L33/50

Abstract: A method for manufacturing a resin molded product is provided. The resin molded product is obtained by molding a resin composition in which quantum dots are dispersed. The method includes stirring resin and metal soap to form a resin mixture, obtaining a quantum dot liquid by dispersing the quantum dots in a solvent, obtaining the resin composition in a solid state by kneading the quantum dot liquid in the resin mixture, and forming a sheet-like shaped resin molded product by extrusion molding the resin composition in the solid state.