公开(公告)号：US20230111374A1

公开(公告)日：2023-04-13

申请号：US17988847

申请日：2022-11-17

Applicant: TOPPAN INC.

Inventor： Noriko KANO ,  Tomoyuki SHIRASAKI ,  Susumu MANIWA

IPC: H01L23/66 ,  H03H7/01 ,  H01L23/498 ,  H03H3/00 ,  H01L21/48

Abstract: A multilayer wiring substrate and a module having the multilayer wiring substrate, wherein the multilayer wiring substrate has a capacitor with a capacitance value smaller than that of the conventional one. The substrate includes a core substrate and capacitors installed therein. At least one of the capacitors is a first capacitor which includes a lower electrode, a dielectric layer, and an upper electrode. The lower electrode is located closer to the core substrate than the dielectric layer and the upper electrode are. The upper electrode is located farther away from the core substrate than the dielectric layer and the lower electrode are. The lower electrode is entirely disposed on the core substrate. The upper electrode has a first portion and a second portion. The first portion overlaps the dielectric layer and the lower electrode to serve as the first capacitor. The second portion extends from the first portion.