公开(公告)号：US20220279651A1

公开(公告)日：2022-09-01

申请号：US17746018

申请日：2022-05-17

Applicant: TOPPAN INC.

Inventor： Susumu MANIWA ,  Masashi SAWADAISHI

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42

Abstract: A glass core multilayer wiring board includes a glass substrate, a through electrode, a first layer structure, and a second layer structure. A through hole has a diameter decreasing from a first surface toward a second surface. The through electrode is along a side wall of the through hole. The first layer structure is on the first surface and the second layer structure is on the second surface. The second layer structure closes an opening in the second surface defining a bottom section. The through electrode has: a first layer on part of the side wall and on part or all of the bottom section of the through hole closing the opening of the through hole, a second layer covering the first layer, the side wall of the through hole exposed, and the bottom section, and a third layer is located on the second layer.

公开(公告)号：US20230039184A1

公开(公告)日：2023-02-09

申请号：US17960287

申请日：2022-10-05

Applicant: TOPPAN INC.

Inventor： Susumu MANIWA

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/18 ,  H05K1/16

Abstract: A glass core wiring substrate incorporating a high-frequency filter having good high-frequency characteristics as a core material and allowing a more efficient arrangement of a conductor in the glass substrate, a module including the same, and a method of manufacturing the glass core wiring substrate incorporating a high-frequency filter. A conductive layer in a glass through a hole in a glass core substrate has a structure in which a hollow cylindrical conductor layer on a side wall of the glass through hole is connected to a cover conductor layer covering one of two openings of the glass through hole. To achieve such a structure, a carrier is attached to one surface of the glass core substrate to cover one of the openings of the glass through hole, and the carrier is peeled off and removed after lamination of the conductor.

公开(公告)号：US20230111374A1

公开(公告)日：2023-04-13

申请号：US17988847

申请日：2022-11-17

Applicant: TOPPAN INC.

Inventor： Noriko KANO ,  Tomoyuki SHIRASAKI ,  Susumu MANIWA

IPC: H01L23/66 ,  H03H7/01 ,  H01L23/498 ,  H03H3/00 ,  H01L21/48

Abstract: A multilayer wiring substrate and a module having the multilayer wiring substrate, wherein the multilayer wiring substrate has a capacitor with a capacitance value smaller than that of the conventional one. The substrate includes a core substrate and capacitors installed therein. At least one of the capacitors is a first capacitor which includes a lower electrode, a dielectric layer, and an upper electrode. The lower electrode is located closer to the core substrate than the dielectric layer and the upper electrode are. The upper electrode is located farther away from the core substrate than the dielectric layer and the lower electrode are. The lower electrode is entirely disposed on the core substrate. The upper electrode has a first portion and a second portion. The first portion overlaps the dielectric layer and the lower electrode to serve as the first capacitor. The second portion extends from the first portion.

公开(公告)号：US20220109416A1

公开(公告)日：2022-04-07

申请号：US17551385

申请日：2021-12-15

Applicant: TOPPAN INC.

Inventor： Noriko KANOU ,  Susumu MANIWA

IPC: H03H7/01 ,  H05K1/11 ,  H05K1/16

Abstract: A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.