公开(公告)号：US20180342386A1

公开(公告)日：2018-11-29

申请号：US15559632

申请日：2016-02-29

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hiroyuki ONISHI ,  Yuki MASUDA

IPC: H01L21/027 ,  C08G59/14

Abstract: A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R1-R4 may be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), R5 represents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of R5s in the same molecule may be the same or different.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.