公开(公告)号：US20230335697A1

公开(公告)日：2023-10-19

申请号：US18028659

申请日：2021-10-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Keika HASHIMOTO ,  Yuki MASUDA

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/56 ,  H01L33/46

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/46 ,  H01L2933/0066 ,  H01L2933/005

Abstract: LED display devices emit light in all directions. Therefore, light is absorbed by peripheral insulating films for insulation of wiring, protective films, partition walls, and the like, and the light-extraction efficiency of a display becomes reduced, resulting in insufficient luminance. According to the present invention, such a problem is solved. This display device comprises at least: a metal wiring; a cured film; and a plurality of light-emitting elements. Each of the light-emitting elements is equipped with a pair of electrode terminals on one surface thereof. The pair of electrode terminals are connected to a plurality of strands of the metal wiring extending in the cured film. The plurality of strands of the metal wiring are configured to maintain electrical insulating properties due to the cured film. The cured film is obtained by curing a resin composition containing a resin (A). The transmittance of the cured film with respect to light having a wavelength of 450 nm is 80-100% at a thickness standard of 5 μm of the cured film.

公开(公告)号：US20190086800A1

公开(公告)日：2019-03-21

申请号：US16301280

申请日：2017-05-22

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki MASUDA ,  Ryoji OKUDA

IPC: G03F7/023 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L23/532

Abstract: The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature.The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.

公开(公告)号：US20180031970A1

公开(公告)日：2018-02-01

申请号：US15551078

申请日：2016-02-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Yuki MASUDA ,  Ryoji OKUDA

IPC: G03F7/075 ,  C08G73/22 ,  C08G8/12 ,  C08F8/00 ,  G03F7/038 ,  G03F7/039 ,  G03F7/023 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/004 ,  G03F7/40 ,  G03F7/022 ,  H01L23/00 ,  C08G73/10

CPC classification number: G03F7/0387 ,  C08F8/00 ,  C08G8/12 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/22 ,  G03F7/004 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/038 ,  G03F7/039 ,  G03F7/075 ,  G03F7/0755 ,  G03F7/0757 ,  G03F7/161 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L24/02 ,  H01L2224/02311 ,  H01L2224/02379 ,  H01L2224/024 ,  H01L2924/07025

Abstract: Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.

公开(公告)号：US20180011402A1

公开(公告)日：2018-01-11

申请号：US15545912

申请日：2016-01-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Tomoyuki YUBA ,  Yuki MASUDA ,  Jiake JIN ,  Ping LI

IPC: G03F7/023 ,  G03F7/16 ,  H01L27/12 ,  H01L23/31 ,  H01L23/29 ,  G03F7/40 ,  G03F7/32 ,  G03F7/20 ,  C07C25/18 ,  C08G73/22 ,  C08G73/10 ,  C07D263/56 ,  C07C231/02 ,  C07C215/80 ,  C07C209/74 ,  H05K1/02 ,  H01L27/32

CPC classification number: G03F7/0233 ,  C07C25/18 ,  C07C41/22 ,  C07C67/307 ,  C07C209/74 ,  C07C211/56 ,  C07C213/00 ,  C07C215/80 ,  C07C231/02 ,  C07C231/12 ,  C07C269/06 ,  C07D209/48 ,  C07D263/56 ,  C07D263/62 ,  C08G69/32 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/106 ,  C08G73/1075 ,  C08G73/1082 ,  C08G73/22 ,  C09D179/04 ,  C09D179/08 ,  G03F7/037 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L21/027 ,  H01L23/293 ,  H01L23/3157 ,  H01L23/3171 ,  H01L27/1248 ,  H01L27/3258 ,  H01L2224/11 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73265 ,  H05K1/0298 ,  H05K3/3452 ,  C07C233/80 ,  C07C233/43 ,  C07C271/28 ,  C07C43/225 ,  C07C69/76 ,  H01L2924/00

Abstract: A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):

公开(公告)号：US20230369271A1

公开(公告)日：2023-11-16

申请号：US18246739

申请日：2021-10-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Keika HASHIMOTO ,  Yuki MASUDA ,  Yu SHOJI

IPC: H01L23/00 ,  H01L25/16 ,  H01L21/48 ,  H01L23/538 ,  H01L27/12

CPC classification number: H01L24/20 ,  H01L25/167 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5385 ,  H01L25/162 ,  H01L27/1259 ,  H01L24/19 ,  H01L27/1248 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2924/01029 ,  H01L2224/19

Abstract: The present invention addresses the problem of degradation of design of an LED display device due to insufficient concealment of wiring by an insulating film for peripheral wiring insulation, a protection film, an isolating wall and the like. This display device comprises at least metal wires, a cured film, and a plurality of light emitting elements, the light emitting elements having a pair of electrode terminals on one surface thereof, the pair of electrode terminals connecting to a plurality of the metal wires extending in the cured film, the plurality of the metal wires being configured to retain an electrical insulating property due to the cured film, wherein the cured film is a film obtained by curing a resin composition comprising an (A) resin, wherein the transmittance of light of a wavelength 450 nm at a thickness reference 5 μm of the cured film is 0.1% to 79% inclusive.
The present invention addresses the problem of degradation of design of an LED display device due to insufficient concealment of wiring by an insulating film for peripheral wiring insulation, a protection film, an isolating wall and the like. This display device comprises at least metal wires, a cured film, and a plurality of light emitting elements, the light emitting elements having a pair of electrode terminals on one surface thereof, the pair of electrode terminals connecting to a plurality of the metal wires extending in the cured film, the plurality of the metal wires being configured to retain an electrical insulating property due to the cured film, wherein the cured film is a film obtained by curing a resin composition comprising an (A) resin, wherein the transmittance of light of a wavelength 450 nm at a thickness reference 5 μm of the cured film is 0.1% to 79% inclusive.

公开(公告)号：US20210116810A1

公开(公告)日：2021-04-22

申请号：US17252934

申请日：2019-07-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Keika HASHIMOTO ,  Yuki MASUDA ,  Yuki TAKEYAMA

IPC: G03F7/038 ,  C08L79/08 ,  C08L61/34 ,  C08J5/18 ,  G03F7/039 ,  C08G73/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L49/02 ,  H01L27/12

Abstract: Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 μm or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).

公开(公告)号：US20190256655A1

公开(公告)日：2019-08-22

申请号：US16343957

申请日：2017-08-28

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki MASUDA ,  Ryoji OKUDA

IPC: C08G69/26 ,  G03F7/075 ,  H01L23/29 ,  G03F7/20 ,  C08G73/08

Abstract: The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200° C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like. (In the general formula (1), R1 and R2 each are a divalent aliphatic group, R3 and R4 each are a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group bonded to an aromatic group by —O—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by —O—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), R5 and R6 each are an organic group having any of a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, a cyano group, an aliphatic group, an aromatic group, an acetyl group, a carboxyl group, an ester group, an amide group, an imide group, and a urea group, A is a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group in which two or more aromatic groups are bonded by a single bond, or a divalent organic group in which two or more aromatic groups are bonded by —O—, —S—, —CO—, —SO2—, —CH2—, —C(CH3)2— or —C(CF3)2— (wherein F is fluorine), p and q each are an integer number in the range of 0 to 3),

公开(公告)号：US20190081258A1

公开(公告)日：2019-03-14

申请号：US15765596

申请日：2016-09-21

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki MASUDA ,  Yu SHOJI ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: H01L51/05 ,  C08L79/08 ,  C08K5/13 ,  G03F7/075 ,  G03F7/20

Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

公开(公告)号：US20170327644A1

公开(公告)日：2017-11-16

申请号：US15529408

申请日：2015-11-19

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki MASUDA ,  Yohei KIUCHI ,  Ryoji OKUDA

IPC: C08G73/10 ,  G03F7/039 ,  H01L21/78 ,  H01L23/00 ,  G03F7/32 ,  H01L21/027 ,  C09D179/08 ,  G03F7/022 ,  G03F7/075 ,  G03F7/16 ,  G03F7/20 ,  G03F7/40

CPC classification number: G03F7/039 ,  C08G69/42 ,  C08G73/10 ,  C08G73/1064 ,  C09D179/08 ,  G03F7/022 ,  G03F7/0233 ,  G03F7/075 ,  G03F7/0755 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L21/027 ,  H01L21/0274 ,  H01L21/78 ,  H01L24/02 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/13024

Abstract: Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).

公开(公告)号：US20190250511A1

公开(公告)日：2019-08-15

申请号：US16329441

申请日：2017-08-30

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuki MASUDA ,  Keika HASHIMOTO ,  Ryoji OKUDA

IPC: G03F7/039 ,  C08G73/14 ,  C09D179/08 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L51/00 ,  H01L23/00 ,  H01L27/12 ,  H01L27/32 ,  H01L51/56

CPC classification number: G03F7/039 ,  C08G69/26 ,  C08G73/06 ,  C08G73/10 ,  C08G73/14 ,  C08J5/18 ,  C09D179/08 ,  G03F7/004 ,  G03F7/023 ,  G03F7/16 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L27/1248 ,  H01L27/3258 ,  H01L51/0018 ,  H01L51/0035 ,  H01L51/0043 ,  H01L51/56 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/03002 ,  H01L2224/03462 ,  H01L2224/0362 ,  H01L2224/13024 ,  H01L2227/323 ,  H01L2924/01029

Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.