公开(公告)号：US20230347448A1

公开(公告)日：2023-11-02

申请号：US18220058

申请日：2023-07-10

Applicant: TOYOKOH Co.,Ltd.

Inventor： Yoichi HONMO ,  Yasunori KATO ,  Tsuyoshi SAITO ,  Masafumi HOSOKAWA ,  Kenjiro MOMI ,  Manabu HARAGUCHI ,  Yuji FURUMAKI ,  Hiroshi SENDA

IPC: B23K26/362 ,  B08B3/04 ,  B32B15/01

CPC classification number: B23K26/362 ,  B08B3/04 ,  B32B15/013 ,  B23K2101/34

Abstract: Provided is a surface treatment method of a metallic material having a protective layer formed thereon. A surface of the protective layer is scanned while irradiating the surface and the surface is scanned while moving an irradiation spot along the surface, in a state in which a side layer of the protective layer along the metallic material remains covering the metallic material, and a side layer of the protective layer opposite to the metallic material side is removed by irradiation with the laser beam.