公开(公告)号：US20240359262A1

公开(公告)日：2024-10-31

申请号：US18644541

申请日：2024-04-24

申请人： GF Machining Solutions SA

发明人： David CONSEIL ,  Charles Eric LAPORTE

IPC分类号： B23K26/082 ,  B23K26/362 ,  G05B19/402

CPC分类号： B23K26/082 ,  B23K26/362 ,  G05B19/402 ,  G05B2219/45165

摘要： A method for computing a machining toolpath applied for laser machining process, in which a laser beam is emitted by a laser head installed in a laser machine tool for ablating the material of a part for forming a pattern thereon.

公开(公告)号：US12130123B2

公开(公告)日：2024-10-29

申请号：US17888231

申请日：2022-08-15

申请人： US Strategic, LLC

发明人： Michael H. Blank

IPC分类号： F42B33/14 ,  B23K26/362

CPC分类号： F42B33/14 ,  B23K26/362

摘要： A headstamp marking method has the steps of fabricating a plurality of inventory cases, each of them being identical with a round surface, a bare metal head, and a body, and the cases being suitable for different caliber cartridges. The method then has trimming or necking the cases, selecting cases for manufacturing into cartridges, and inscribing, via a laser inscription device, the cases upon their heads. The laser inscription identifies at least the caliber of the cartridge and the number of the cases for manufacturing. The laser inscription device, while removing material of the head along its path, attains insufficient heat and thus avoids compromising the structure of the cartridges and igniting them. The laser inscription device aims and focuses its laser upon a common plane of a head while exhausting its heat through the material ejected from the head.

公开(公告)号：US12128502B2

公开(公告)日：2024-10-29

申请号：US17236897

申请日：2021-04-21

申请人： Makeblock Co., Ltd.

发明人： Yuchao Liu

IPC分类号： B23K26/36 ,  B23K26/362

CPC分类号： B23K26/362

摘要： A control method of laser processing, a laser processing apparatus, and non-transitory computer readable storage medium are provided. The control method of laser processing includes the following. An image of a to-be-processed material is captured via a camera mounted on a laser processing apparatus, where the captured image is used for depicting the to-be-processed material and lines drawn on the to-be-processed material. Processing lines of the to-be-processed material are identified according to the drawn lines in the captured image. Laser processing is performed on the to-be-processed material according to the processing lines, to obtain a laser product corresponding to the drawn lines.

公开(公告)号：US20240351774A1

公开(公告)日：2024-10-24

申请号：US18687062

申请日：2022-08-25

申请人： BRITISH AMERICAN TOBACCO (INVESTMENTS) LIMITED

发明人： Michael CHURCHER ,  Paul HODGES

IPC分类号： B65D85/10 ,  B23K26/00 ,  B23K26/362 ,  B23K103/00

CPC分类号： B65D85/1045 ,  B23K26/0093 ,  B23K26/362 ,  B23K2103/40

摘要： A pack including a base and a lid mounted to the base for rotation between open and closed positions, the lid being configured to separate from an upper edge of the base when rotated into the open position; wherein the base includes front and rear panels separated by side panels, wherein corners of the base between the front panel and side panels each include a right angled corner section and a chamfered or filleted corner section, the right angled corner section extending between the upper edge of the base and the chamfered or filleted corner section, and wherein corners of the base between the rear panel and side panels form a right angled corner along their full length.

公开(公告)号：US20240342828A1

公开(公告)日：2024-10-17

申请号：US18638305

申请日：2024-04-17

申请人： JENOPTIK Automatisierungstechnik GmbH

发明人： André KERN ,  Jan LANGEBACH ,  Christian DOERING ,  Benjamin GRABIGER

IPC分类号： B23K26/082 ,  B23K26/03 ,  B23K26/359 ,  B23K26/362

CPC分类号： B23K26/082 ,  B23K26/032 ,  B23K26/359 ,  B23K26/362

摘要： A method for creating a pattern figure formed of pattern points, in a workpiece, using a laser device of a machining device comprises reading in first position data, which define positions of first pattern points on the workpiece, wherein the first pattern points are associated with a first portion of a polyline of the pattern figure associated with the first pattern, introduction of the first pattern points into the workpiece taking place while the machining device is located in a first position, a detection of a course of an end of the first portion of the polyline, a continuation of the course of the end of the first portion of the polyline, and an introduction of second pattern points of a second portion of the polyline into the workpiece using the continued course, while the machining device is in a second position.

公开(公告)号：US12106973B2

公开(公告)日：2024-10-01

申请号：US17513037

申请日：2021-10-28

申请人： Silicon Laboratories Inc.

发明人： Erwin Hendarto

IPC分类号： H01L21/56 ,  B23K26/362 ,  B23K101/40 ,  H01L21/67 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552

CPC分类号： H01L21/565 ,  B23K26/362 ,  H01L21/67075 ,  H01L23/3157 ,  H01L23/552 ,  H01L24/49 ,  B23K2101/40 ,  H01L2924/01047 ,  H01L2924/18165

摘要： In one embodiment, a method includes: laser ablating an encapsulant of a semiconductor package, until a threshold amount of the encapsulant remains above one or more die of the semiconductor package; and providing at least one drop of acid onto a surface of the ablated semiconductor package to acid etch for a first time duration, to remove a remaining portion of the encapsulant above the one or more die, where after the acid etch, a die of interest is exposed and the silver bond wires of the semiconductor package are preserved.

公开(公告)号：US20240269776A1

公开(公告)日：2024-08-15

申请号：US18268559

申请日：2020-12-21

申请人： ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)

发明人： Luc BURNIER ,  Andreas SCHUELER

IPC分类号： B23K26/362 ,  B23K26/06 ,  B23K26/067

CPC分类号： B23K26/362 ,  B23K26/0648 ,  B23K26/067

摘要： The present invention concerns a laser engraving device for engraving a target surface. The laser engraving device comprises: a beam splitter for dividing a processing laser beam into a plurality of engraving laser beams; a first optical focusing element with an adjustable focal point for focusing the plurality of engraving laser beams onto the target surface; and an optical sensor configured to determine the distance between the target surface and the optical sensor. The first optical focusing element is connected to the optical sensor by a data link to receive the determined distance from the optical sensor. Furthermore, the first optical focusing element is configured to adjust its focal point based on the determined distance received from the optical sensor.

公开(公告)号：US20240251517A1

公开(公告)日：2024-07-25

申请号：US18588313

申请日：2024-02-27

申请人： Lutron Technology Company LLC

发明人： Dmitriy Vinokurov ,  Daniel C. Raneri ,  Alexander W. Gage

IPC分类号： H05K5/03 ,  B23K26/361 ,  B23K26/362 ,  B44C1/22 ,  B44C5/04 ,  G09F13/00 ,  H01B17/00 ,  H01H9/02 ,  H01H9/16 ,  H05K5/00

CPC分类号： H05K5/03 ,  B23K26/361 ,  B23K26/362 ,  B44C1/22 ,  B44C5/0415 ,  B44C5/0446 ,  G09F13/00 ,  H01B17/00 ,  H01H9/16 ,  H01H9/161 ,  H01H2009/0292 ,  H05K5/0017

摘要： A veneer for a wall-mounted keypad may include indicia that are laser cut therethrough and that are representative of functions that may be performed by the keypad. The veneer may include a recess that extends into an inner surface of the veneer, proximate to the indicia. The recess may be shaped such that a perceived aesthetic of an outer surface of the veneer is preserved during formation of the indicia. The recess may for example have an organic shape defined by a curved outer perimeter that does not define any corners.

公开(公告)号：US20240243716A1

公开(公告)日：2024-07-18

申请号：US18531065

申请日：2023-12-06

申请人： Skyworks Solutions, Inc.

发明人： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25

CPC分类号： H03H3/08 ,  B23K26/362 ,  H03H9/02559 ,  H03H9/02622 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1092 ,  H03H9/25 ,  G01N2291/0423 ,  H01L2224/16

摘要： Laser-marked packaged surface acoustic wave devices are provided. The laser-marked packaged surface acoustic wave device may include a package structure encapsulating a surface acoustic wave device on a first side of a piezoelectric substrate. The opposite side of the piezoelectric substrate can be directly marked using a laser. The laser may be a deep ultraviolet laser. By directly marking the piezoelectric substrate itself, the use of a separate marking film can be avoided, making the packaged surface acoustic wave device thinner. When the laser has a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings can extend less than 1 micrometer into the piezoelectric substrate, so as not to affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

公开(公告)号：US20240207969A1

公开(公告)日：2024-06-27

申请号：US18525021

申请日：2023-11-30

申请人： Elemental Scientific Lasers, LLC

发明人： Ciaran J. O'Connor ,  Erik B. Larsen ,  Leif C. Summerfield

IPC分类号： B23K26/03 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/082 ,  B23K26/12 ,  B23K26/361 ,  B23K26/362 ,  B23K26/402 ,  B23K103/00 ,  G01N1/44 ,  G01N21/71 ,  G01N21/88 ,  G02B21/00 ,  G02B26/10 ,  G06T7/00 ,  H01J49/04

CPC分类号： B23K26/032 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0861 ,  B23K26/0876 ,  B23K26/123 ,  B23K26/127 ,  B23K26/361 ,  B23K26/362 ,  G01N1/44 ,  G01N21/718 ,  G01N21/8806 ,  G06T7/0004 ,  B23K26/402 ,  B23K2103/30 ,  B23K2103/50 ,  G02B21/0016 ,  G02B26/105 ,  G06T2207/10056 ,  G06T2207/20021 ,  G06T2207/20104 ,  H01J49/04

摘要： A laser ablation system, and method, facilitates the execution of user-defined scans (i.e., in which a laser beam is scanned across a sample along a beam trajectory to ablate or dissociate a portion of the sample) and enables the user define additional scans while a scan is being executed.