公开(公告)号：US11829544B1

公开(公告)日：2023-11-28

申请号：US17865451

申请日：2022-07-15

申请人： TPK Advanced Solutions Inc.

发明人： Chih Sheng Wang ,  Li Hung Chang ,  Jin Huo Liao

IPC分类号： G06F3/041 ,  B32B7/14 ,  B32B37/12 ,  B32B37/10 ,  B32B3/08

CPC分类号： G06F3/0412 ,  B32B3/08 ,  B32B7/14 ,  B32B37/10 ,  B32B37/1292 ,  B32B2305/72 ,  B32B2307/414 ,  B32B2457/208 ,  G06F2203/04103

摘要： An electronic device includes a cover plate assembly, a frameless display panel assembly, and an adhesive layer. The cover plate assembly has a first major surface. A peripheral region of the first major surface has a first area. The frameless display panel assembly is disposed below the cover plate assembly and has a second major surface. A peripheral region of the second major surface has a second area smaller than the first area. The adhesive layer is disposed between the peripheral region of the first major surface and the peripheral region of the second major surface. The adhesive layer is a frame-shaped and elastic colloid. The adhesive layer, the cover plate assembly, and the frameless display panel assembly together form a closed space after being pressed together, and the closed space has a spacing smaller than 200 microns.