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公开(公告)号：US20240049396A1
公开(公告)日：2024-02-08
申请号：US18363921
申请日：2023-08-02
发明人： Cheng Ming LU , Han-Ching SHIH , Hsu TU , Wen-Che CHEN , Wu-Chiang MA
CPC分类号： H05K3/0044 , H05K3/0026 , H05K3/0055 , H05K1/0278 , H05K3/06
摘要： A method for manufacturing a semi-flex printed circuit board is provided, including: forming two convex metal dam structures and two concave laser cut grooves on a side surface of the core substrate; wherein inner sides of the two metal dam structures form a printing area at the side surface of the core substrate, and the positions of the two laser cut grooves correspond to the printing area; printing a strippable printing ink in the printing area on the core substrate; laminating a build-up board structure on the side surface of the core substrate; and forming two blind routing openings on another side surface of the core substrate, which correspond to the two laser cut grooves in position respectively; removing a cover-opening structure of the core substrate between the two blind routing openings, so as to form a cover-opening opening.
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公开(公告)号：US20240049401A1
公开(公告)日：2024-02-08
申请号：US18364013
申请日：2023-08-02
发明人： Cheng Ming LU , Han-Ching SHIH , Hsu TU , Wen-Che CHEN , Wu-Chiang MA
CPC分类号： H05K3/4691 , H05K1/182
摘要： A semi-flex printed circuit board with cover-opening opening is disclosed. An inner side of the core substrate surrounds a cover-opening opening. The two metal dam structures are arranged on a side surface of the core substrate; and the two metal dam structures and the core substrate jointly surround the cover-opening opening. The core board is arranged on a side surface of the bonding sheet away from the core substrate. Two sides of a bottom of the core substrate surrounding the cover-opening opening are provided with two laser cutting sidewalls respectively. Sidewalls of the two metal dam structures surrounding the cover-opening opening are connected with the two laser cutting sidewalls respectively and each defined as a metal dam sidewall. An obtuse angle presents between the metal dam sidewall and the laser cutting sidewall.
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