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公开(公告)号：US20250058520A1
公开(公告)日：2025-02-20
申请号：US18685671
申请日：2022-08-22
Applicant: TRUSTEES OF DARTMOUTH COLLEGE
Inventor： William SCHEIDELER , Julia HUDDY
IPC: B29C64/30 , B33Y40/20 , C23C16/34 , C23C16/40 , C23C16/455
Abstract: A 3D printed, complex polymer structure can include a seed layer on the polymer structure. A thin film can be disposed on the seed layer. The seed layer can be an oxide, a nitride, or an oxynitride. The thin film can be an oxide, dielectric, semiconductor, or conductor. The polymer structure can be a lattice structure, cantilever, beam, or other shapes.
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