公开(公告)号：US09385479B1

公开(公告)日：2016-07-05

申请号：US14809442

申请日：2015-07-27

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Matthew Ryan Schmitt ,  Paul Steven Sremcich ,  Steve Douglas Sattazahn ,  Brandon Michael Matthews

IPC: H01R13/648 ,  H01R13/6471 ,  H01R24/60 ,  H01R13/504

CPC classification number: H01R13/6471 ,  H01R13/504 ,  H01R24/60

Abstract: A connector sub-assembly includes a dielectric carrier, plural signal conductors, and a ground frame. The dielectric carrier is defined by first and second overmolded bodies that engage one another at an overmold interface. An intermediate segment of each signal conductor is encased within the dielectric carrier. The ground frame is held between the first and second overmolded bodies at the overmold interface. The ground frame includes a ground bus bar encased within the dielectric carrier and plural ground conductors extending from the ground bus bar. The second overmolded body is formed in-situ on an inner side of the first overmolded body. An inner side of the second overmolded body at the overmold interface is partially defined by a profile of the inner side of the first overmolded body and partially defined by the ground frame.

Abstract translation: 连接器子组件包括电介质载体，多个信号导体和接地框架。 电介质载体由在包覆模制界面处彼此接合的第一和第二包覆成型体限定。 每个信号导体的中间段被封装在电介质载体内。 地面框架保持在包覆模制界面处的第一和第二包覆成型体之间。 接地框架包括一个封装在电介质载体内的接地母线和从接地母线延伸的多个接地导体。 第二包覆成型体在第一包覆成型体的内侧上原位形成。 在包覆模制界面处的第二包覆成型体的内侧部分地由第一包覆成型体的内侧的轮廓限定并且部分地由接地框架限定。