公开(公告)号：US20100193940A1

公开(公告)日：2010-08-05

申请号：US12382907

申请日：2009-03-26

申请人： Tae Hyun Kim ,  Tae Hoon Kim ,  Yun Pyo Kwak ,  Sung Keun Park ,  Jong Yeol Jeon

发明人： Tae Hyun Kim ,  Tae Hoon Kim ,  Yun Pyo Kwak ,  Sung Keun Park ,  Jong Yeol Jeon

IPC分类号： H01L23/02 ,  H01L21/52

CPC分类号： H01L23/10 ,  H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/00

摘要： The present invention relates to a wafer level package and a method of manufacturing the same. The wafer level package includes a first substrate including a first region and second regions with grooves around the first region; a semiconductor device positioned in the first region; first sealing members positioned in the grooves; a second substrate including projection units corresponding to the second regions in order to form a cavity corresponding to the first region; and second sealing members which are positioned above the projection units and laminate the first and second substrates to each other by being bonded to the first sealing members, and can prevent the sealing members from flowing to any region except for the sealing regions.

摘要翻译： 本发明涉及一种晶片级封装及其制造方法。 晶片级封装包括包括第一区域的第一基板和围绕第一区域的凹槽的第二区域; 位于所述第一区域中的半导体器件; 位于凹槽中的第一密封构件; 第二基板，包括对应于第二区域的投影单元，以形成对应于第一区域的空腔; 以及第二密封构件，其位于投影单元的上方并且通过结合到第一密封构件将第一和第二基板彼此层合，并且可以防止密封构件流到除了密封区域之外的任何区域。