公开(公告)号：US20160205776A1

公开(公告)日：2016-07-14

申请号：US14620197

申请日：2015-02-12

Applicant: Taiflex Scientific Co., Ltd.

Inventor： Hsiu-Chu Wu ,  Ching-Wen Yu ,  Wen-Chien Chen ,  Wu-Ying Su ,  Wei-Yuan Huang ,  Meng-Cheng Tsai ,  Chi-Sheng Hung

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0393 ,  H05K3/007 ,  H05K3/025 ,  H05K2201/0154

Abstract: A cover film with high dimensional stability includes an insulation film, a first adhesive layer, and a carrier. A first side of the first adhesive layer is connected to a first surface of the insulation film, and a second side of the first adhesive layer is configured to adhere to at least one metal conductor of a flexible printed circuit board. The carrier includes a supporting film and a second adhesive layer. A first side of the second adhesive layer is connected to the supporting film, and a second side of the second adhesive layer is adhered to a second surface of the insulation film, wherein bonding strength of the second adhesive film is smaller than bonding strength of the first adhesive film.

Abstract translation: 具有高尺寸稳定性的覆盖膜包括绝缘膜，第一粘合剂层和载体。 第一粘合剂层的第一侧连接到绝缘膜的第一表面，并且第一粘合剂层的第二侧被配置为粘附到柔性印刷电路板的至少一个金属导体。 载体包括支撑膜和第二粘合剂层。 第二粘合剂层的第一面连接到支撑膜，第二粘合剂层的第二侧粘附到绝缘膜的第二表面，其中第二粘合膜的接合强度小于 第一胶粘剂。