公开(公告)号：US20150243696A1

公开(公告)日：2015-08-27

申请号：US14192322

申请日：2014-02-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Volume CHIEN ,  Kun-Huei LIN ,  Chia-Yu WEI ,  Allen TSENG ,  Chi-Cherng JENG ,  Chuan-Pu LIU

IPC: H01L27/146 ,  H04N5/374

CPC classification number: H01L27/14623 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14685

Abstract: The disclosure provides an image sensor device and a manufacturing method. The image sensor device includes a semiconductor substrate and a light sensing region in the semiconductor substrate. The image sensor device also includes a light blocking structure in the semiconductor substrate and adjacent to the light sensing region. A sidewall of the light blocking structure is a curved surface.

Abstract translation: 本公开提供了一种图像传感器装置和制造方法。 图像传感器装置包括半导体衬底和半导体衬底中的光感测区域。 图像传感器装置还包括在半导体衬底中并与光感测区相邻的遮光结构。 遮光结构的侧壁是曲面。