公开(公告)号：US20250062274A1

公开(公告)日：2025-02-20

申请号：US18451982

申请日：2023-08-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jen-Hao Liu ,  Amram Eitan ,  Chih-Yuan Chiu ,  Chi-Chun Peng ,  Yu-Hong Du

IPC: H01L23/00

Abstract: A bonding apparatus with a bonding head having vacuum channels and switchable channels, and the method of forming the same are provided. The bonding apparatus may include a vacuum pump, a blower, a controller communicatively coupled to the vacuum pump and the blower, and a bonding head. The bonding head may include a main body, a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump, and a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.