公开(公告)号：US11450588B2

公开(公告)日：2022-09-20

申请号：US16654198

申请日：2019-10-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shin Chi ,  Chien-Hao Hsu ,  Kuo-Chin Chang ,  Cheng-Nan Lin ,  Mirng-Ji Lii

IPC: H01L23/373 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

Abstract: A method for forming a chip package structure is provided. The method includes disposing a chip over a substrate. The method includes forming a heat-spreading wall structure over the substrate. The heat-spreading wall structure is adjacent to the chip, and there is a first gap between the chip and the heat-spreading wall structure. The method includes forming a first heat conductive layer in the first gap. The method includes forming a second heat conductive layer over the chip. The method includes disposing a heat-spreading lid over the substrate to cover the heat-spreading wall structure, the first heat conductive layer, the second heat conductive layer, and the chip. The heat-spreading lid is bonded to the substrate, the heat-spreading wall structure, the first heat conductive layer, and the second heat conductive layer.