公开(公告)号：US09892982B2

公开(公告)日：2018-02-13

申请号：US14146996

申请日：2014-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Shu Tseng ,  Chien-Hua Chen ,  You-Feng Chen ,  Yen-Yu Chen ,  Zhong-Yi Chen ,  Yung-Haw Liaw

IPC: H01L21/027 ,  H01L21/66 ,  H01L21/67

CPC classification number: H01L22/26 ,  H01L21/0276 ,  H01L21/67017 ,  H01L21/67253

Abstract: Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes placing the wafer into a processing assembly and heating the wafer. The method also includes producing an exhaust flow from the processing assembly via a fluid-conduit assembly. The method further includes detecting an exhaust pressure of the exhaust flow in the fluid-conduit assembly and producing a first signal and a second signal corresponding to the exhaust pressure. In addition, the method includes regulating the exhaust flow in response to the first signal and controlling the processing assembly in response to the second signal.