公开(公告)号：US11162174B2

公开(公告)日：2021-11-02

申请号：US16136870

申请日：2018-09-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Lung Yang ,  Chui-Ya Peng ,  Chih-Ta Kuan

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/52 ,  C23C16/46 ,  C23C16/448

Abstract: The present disclosure relates to an apparatus and a method of delivering a liquid to a downstream process. The apparatus can include a vessel configured to retain a liquid, a bellow in fluid communication with the vessel to receive the liquid from the vessel and in fluid communication with the downstream process to deliver the liquid. The bellow can be exposed to a constant external pressure and configured to deliver the liquid under the constant external pressure when the bellow stops receiving the liquid from the vessel. In some embodiments, the constant external pressure is atmospheric pressure. The bellow can include a pressure deformable material. The apparatus can further include a vaporizer configured to receive the liquid and to produce a vapor, one or more chemical vapor deposition chambers configured to receive the vapor and to hold a substrate for deposition of a component of the vapor on a substrate.