SYSTEMS AND METHODS FOR FABRICATING AND ORIENTING SEMICONDUCTOR WAFERS
    1.
    发明申请
    SYSTEMS AND METHODS FOR FABRICATING AND ORIENTING SEMICONDUCTOR WAFERS 审中-公开
    用于制造和定向半导体晶体管的系统和方法

    公开(公告)号:US20150009499A1

    公开(公告)日:2015-01-08

    申请号:US14494621

    申请日:2014-09-24

    Abstract: A system for orienting a semiconductor wafer. The system includes a wafer retaining device configured to retain a semiconductor wafer, a light source configured to emit light toward an edge exclusion area of the wafer, and a lens configured to direct and focus light emitted from the light source at a subsurface first part of a first portion of the wafer to alter a crystalline structure of the subsurface first part and form a subsurface mark that is detectable using light of a predetermined wavelength, a predetermined transmittance through the wafer, and at a predetermined reflectance angle relative to an axis of rotation of the wafer and based on the predetermined wavelength.

    Abstract translation: 一种用于定向半导体晶片的系统。 该系统包括被配置为保持半导体晶片的晶片保持装置,被配置为朝向晶片的边缘排除区域发光的光源,以及被配置为将来自光源的光从第一部分 晶片的第一部分,以改变地下第一部分的晶体结构,并形成可使用预定波长的光,通过晶片的预定透射率和相对于旋转轴线的预定反射角可检测的地下标记 并且基于预定波长。

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