公开(公告)号：US20240387368A1

公开(公告)日：2024-11-21

申请号：US18788881

申请日：2024-07-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chin-Yi Lin ,  Jie Chen ,  Sheng-Han Tsai ,  Yuan Sheng Chiu ,  Chou-Jui Hsu ,  Yu Kuei Yeh ,  Tsung-Shu Lin

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/532

Abstract: A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.

公开(公告)号：US20230361027A1

公开(公告)日：2023-11-09

申请号：US17819381

申请日：2022-08-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chin-Yi Lin ,  Jie Chen ,  Sheng-Han Tsai ,  Yuan Sheng Chiu ,  Chou-Jui Hsu ,  Yu Kuei Yeh ,  Tsung-Shu Lin

IPC: H01L23/528 ,  H01L23/532 ,  H01L23/00

CPC classification number: H01L23/528 ,  H01L23/53209 ,  H01L24/27 ,  H01L24/33 ,  H01L2224/33104

Abstract: A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.