STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PACKAGE BY USING POLYMER WAVEGUIDE

    公开(公告)号:US20220365294A1

    公开(公告)日:2022-11-17

    申请号:US17320596

    申请日:2021-05-14

    Abstract: Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.

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