公开(公告)号：US20180373113A1

公开(公告)日：2018-12-27

申请号：US15663489

申请日：2017-07-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Hui-Yu LEE ,  Jui-Feng KUAN

IPC: G02F1/225 ,  H03M1/06 ,  H03M1/12

Abstract: A device is disclosed that includes a comparator and a configurable heater. The comparator is configured to compare a transmission phase of a light transmitted in a photonic component with a reference phase to generate a phase difference. The configurable heater is disposed with respect to the photonic component and includes a plurality of heater segments, wherein a number of the heater segments in operation is trimmable based on the phase difference.

公开(公告)号：US20220365294A1

公开(公告)日：2022-11-17

申请号：US17320596

申请日：2021-05-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hao CHEN ,  Hui-Yu LEE ,  Chung-Ming WENG ,  Jui-Feng KUAN ,  Chien-Te WU

IPC: G02B6/42

Abstract: Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.

公开(公告)号：US20250130379A1

公开(公告)日：2025-04-24

申请号：US18961072

申请日：2024-11-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Hao CHEN ,  Hui-Yu LEE ,  Chung-Ming WENG ,  Jui-Feng KUAN ,  Chien-Te WU

IPC: G02B6/42 ,  G02B6/122

Abstract: Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.