专利检索 ap:("Taiwan Semiconductor Manufacturing Co., Ltd.") AND inv:"Fang-I CHIH" 第 1 页

1.

发明申请
COMPOSITIONS FOR USE IN CHEMICAL MECHANICAL POLISHING 审中-公开

公开(公告)号：US20200040221A1

公开(公告)日：2020-02-06

申请号：US16503255

申请日：2019-07-03

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Fang-I CHIH , Chih-Chieh CHANG , Hui-Chi HUANG , Kei-Wei CHEN

IPC分类号： C09G1/02 , B24B37/20

摘要： A polishing composition for a chemical mechanical polishing process includes abrasive particles, at least one chemical additive, and a non-aqueous solvent.