公开(公告)号：US20220013480A1

公开(公告)日：2022-01-13

申请号：US16924216

申请日：2020-07-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Fa Chen ,  Chao-Wen Shih ,  Tzuan-Horng Liu ,  Jen-Li Hu

IPC: H01L23/00 ,  H01L23/64 ,  H01L23/522 ,  H01L21/768

Abstract: Provided is packages and methods of fabricating a package and. The method includes bonding a first device die with a second device die. The second device die is over the first device die. A bonding structure is formed in a combined structure including the first and the second device dies. A component is formed in the bonding structure. The component includes a passive device or a transmission line. The method further includes forming a first and a second electrical connectors electrically coupling to a first end and a second end of the component.

公开(公告)号：US11587894B2

公开(公告)日：2023-02-21

申请号：US16924216

申请日：2020-07-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Fa Chen ,  Chao-Wen Shih ,  Tzuan-Horng Liu ,  Jen-Li Hu

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/522 ,  H01L23/64

Abstract: Provided is packages and methods of fabricating a package and. The method includes bonding a first device die with a second device die. The second device die is over the first device die. A bonding structure is formed in a combined structure including the first and the second device dies. A component is formed in the bonding structure. The component includes a passive device or a transmission line. The method further includes forming a first and a second electrical connectors electrically coupling to a first end and a second end of the component.