公开(公告)号：US20040018808A1

公开(公告)日：2004-01-29

申请号：US10202196

申请日：2002-07-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung Lin ,  Tien-Chen Hu ,  Tso-Hsu Lin ,  Hong-Chin Pu ,  Jeng-Fang Chang ,  Der-Yuan Hong

IPC: B24B021/00

CPC classification number: B24B37/005 ,  B24B21/20

Abstract: A tensioning assembly for a polishing belt on a linear chemical mechanical polishing apparatus. The tensioning assembly comprises first and second rollers which are operably engaged by respective air cylinders and exert a selected degree of downward tension on the lower run of the horizontal polishing belt. A third roller biased typically by a spring pushes upwardly on the lower run of the belt between the first and second rollers. Accordingly, the first and second rollers, in conjunction with the third roller, tension the belt on the apparatus to maintain optimum material removal rates and uniformity. The degree of tension exerted on the belt can be varied according to stretching of the belt resulting from prolonged use.