公开(公告)号：US11476219B2

公开(公告)日：2022-10-18

申请号：US17026983

申请日：2020-09-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jung-Hua Chang ,  Jian-Yang He ,  Chin-Fu Kao

IPC: H01L21/78 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L23/29

Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.

公开(公告)号：US20210005564A1

公开(公告)日：2021-01-07

申请号：US17026983

申请日：2020-09-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jung-Hua Chang ,  Jian-Yang He ,  Chin-Fu Kao

IPC: H01L23/00 ,  H01L21/78 ,  H01L25/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.

公开(公告)号：US12272663B2

公开(公告)日：2025-04-08

申请号：US17815728

申请日：2022-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jung-Hua Chang ,  Jian-Yang He ,  Chin-Fu Kao

IPC: H01L21/78 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00

Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.

公开(公告)号：US20220367397A1

公开(公告)日：2022-11-17

申请号：US17815728

申请日：2022-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jung-Hua Chang ,  Jian-Yang He ,  Chin-Fu Kao

IPC: H01L23/00 ,  H01L21/78 ,  H01L25/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.