公开(公告)号：US20210066279A1

公开(公告)日：2021-03-04

申请号：US16888874

申请日：2020-06-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Chun-Hui Yu ,  Kuo-Chung Yee ,  Liang-Ju Yen

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L25/00

Abstract: One of semiconductor packages includes a substrate and a package structure. The package structure is bonded to the substrate and includes a first redistribution layer structure, a first logic die, a plurality of second logic dies, a first memory die, a first heat conduction block and a first encapsulant. The first logic die and the second logic dies are disposed over and electrically connected to the first redistribution layer structure. The first memory die is disposed over the first logic die and the second logic dies and electrically connected to first redistribution layer structure. The first heat conduction block is disposed over the first logic die and the second logic dies. The first encapsulant encapsulates the first memory die and the first heat conduction block.