公开(公告)号：US20250062201A1

公开(公告)日：2025-02-20

申请号：US18501254

申请日：2023-11-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Shien Chen ,  Chi-Yen Lin ,  Po-Chen Chen ,  Wu-An Weng ,  Hsu-Hsien Chen

IPC: H01L23/498 ,  H01L21/02 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065

Abstract: A package includes a first integrated circuit die and a second integrated circuit die over and bonded to the first integrated circuit die. A first surface region of the second integrated circuit die is hydrophobic, and the first integrated circuit die and the second integrated circuit die are bonded together with dielectric-to-dielectric bonds and metal-to-metal bonds. The package further includes a first insulating material over the first integrated circuit and surrounding the second integrated circuit die. The first insulating material contacts the first surface region.