公开(公告)号：US11094682B2

公开(公告)日：2021-08-17

申请号：US16744194

申请日：2020-01-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Rabiul Islam ,  Chuei-Tang Wang ,  Stefan Rusu ,  Weiwei Song

IPC: H01L23/31 ,  H01L21/56 ,  G02B6/12 ,  H01L25/16 ,  H01L23/367 ,  H01L23/00

Abstract: A package structure includes a package component, a stacked die package, a plurality of optical fibers and a heat spreading structure. The stacked die package is disposed on and electrically connected to the package component. The stacked die package includes a first semiconductor die and a plurality of second semiconductor dies. The first semiconductor die has a plurality of first bonding elements. The second semiconductor dies are disposed on the first semiconductor die and have a plurality of second bonding elements, wherein the plurality of first bonding elements and the plurality of second bonding elements are facing one another and bonded together through hybrid bonding. The plurality of optical fibers is attached to the plurality of second semiconductor dies of the stacked die package. The heat spreading structure is disposed on the package component and surrounding the stacked die package.

公开(公告)号：US20210225824A1

公开(公告)日：2021-07-22

申请号：US16744194

申请日：2020-01-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Rabiul Islam ,  Chuei-Tang Wang ,  Stefan Rusu ,  Weiwei Song

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  G02B6/12

Abstract: A package structure includes a package component, a stacked die package, a plurality of optical fibers and a heat spreading structure. The stacked die package is disposed on and electrically connected to the package component. The stacked die package includes a first semiconductor die and a plurality of second semiconductor dies. The first semiconductor die has a plurality of first bonding elements. The second semiconductor dies are disposed on the first semiconductor die and have a plurality of second bonding elements, wherein the plurality of first bonding elements and the plurality of second bonding elements are facing one another and bonded together through hybrid bonding. The plurality of optical fibers is attached to the plurality of second semiconductor dies of the stacked die package. The heat spreading structure is disposed on the package component and surrounding the stacked die package.