公开(公告)号：US09970105B2

公开(公告)日：2018-05-15

申请号：US14138495

申请日：2013-12-23

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Ta Chen ,  Cheng-Chieh Chen ,  Hong-Hsing Chou ,  Yeh-Chieh Wang ,  Jeng-Yann Tsay ,  Shyue-Shin Tsai ,  Tsung-Yang Liu

IPC分类号： C23C16/44 ,  H01L21/67 ,  H01J37/32

CPC分类号： C23C16/4409 ,  H01J37/32513 ,  H01L21/67126

摘要： Embodiments of method for cooling a wafer are provided. A method for cooling a wafer includes placing the wafer in a processing module via a passage of a seat member. The method also includes moving a closure member toward the seat member in a diagonal manner. The method further includes engaging the seat member and the closure member and placing a portion of the closure member inside the passage. In addition, the method includes performing a process on the wafer in the processing module.