公开(公告)号：US20230062902A1

公开(公告)日：2023-03-02

申请号：US17461147

申请日：2021-08-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Chun HSIEH ,  Tsung-Yu TSAI ,  Hsing-Yuan HUANG ,  Chih-Chang WU ,  Szu-Hua WU ,  Chin-Szu LEE

IPC: C23C14/50 ,  H01L21/677 ,  C23C14/34 ,  H01L21/687

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.