公开(公告)号：US20200279766A1

公开(公告)日：2020-09-03

申请号：US16876287

申请日：2020-05-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wang-Hua LIN ,  Chun-Liang TAI ,  Chun-Hsiang FAN ,  Ming-Hsi YEH ,  Kuo-Bin HUANG

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/08 ,  B08B3/10

Abstract: A method for cleaning a semiconductor wafer is provided. The method includes placing a semiconductor wafer over a supporter arranged around a central axis of a spin base. The method further includes securing the semiconductor wafer using a clamping member positioned on the supporter. The movement of the semiconductor wafer during the placement of the semiconductor wafer over the supporter is guided by a guiding member located over the clamping member. The method also includes spinning the semiconductor wafer by rotating the spin base about the central axis. In addition, the method includes dispensing a processing liquid over the semiconductor wafer.

公开(公告)号：US20190148212A1

公开(公告)日：2019-05-16

申请号：US15812112

申请日：2017-11-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wang-Hua LIN ,  Chun-Liang TAI ,  Chun-Hsiang FAN ,  Ming-Hsi YEH ,  Kuo-Bin HUANG

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/10 ,  B08B3/08

Abstract: A method for cleaning a semiconductor wafer is provided. The method includes placing a semiconductor wafer over a supporter arranged around a central axis of a spin base. The method further includes securing the semiconductor wafer using a clamping member positioned on the supporter. The movement of the semiconductor wafer during the placement of the semiconductor wafer over the supporter is guided by a guiding member located over the clamping member. The method also includes spinning the semiconductor wafer by rotating the spin base about the central axis. In addition, the method includes dispensing a processing liquid over the semiconductor wafer.