公开(公告)号：US10518387B2

公开(公告)日：2019-12-31

申请号：US15652244

申请日：2017-07-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yi-Chao Mao ,  Chin-Chuan Chang ,  Jing-Cheng Lin ,  Wen-Hua Chang

IPC: B24D7/06 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/31 ,  H01L23/538

Abstract: A grinding element mounted on a grinding wheel and a grinding wheel containing the same are provided for grinding. The grinding element includes a grinding tooth, and the grinding tooth includes a grinding material having a framework structure and pores distributed in the framework structure. The framework structure includes a bond material and abrasive particles that are bonded by the bond material. A pore size of the pores is larger than 40 microns but smaller than 70 microns. A manufacturing method for semiconductor packages using the same is also provided.

公开(公告)号：US20190022827A1

公开(公告)日：2019-01-24

申请号：US15652244

申请日：2017-07-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yi-Chao Mao ,  Chin-Chuan Chang ,  Jing-Cheng Lin ,  Wen-Hua Chang

IPC: B24D7/06 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/31 ,  H01L23/538

Abstract: A grinding element mounted on a grinding wheel and a grinding wheel containing the same are provided for grinding. The grinding element includes a grinding tooth, and the grinding tooth includes a grinding material having a framework structure and pores distributed in the framework structure. The framework structure includes a bond material and abrasive particles that are bonded by the bond material. A pore size of the pores is larger than 40 microns but smaller than 70 microns. A manufacturing method for semiconductor packages using the same is also provided.