公开(公告)号：US20250125224A1

公开(公告)日：2025-04-17

申请号：US18442677

申请日：2024-02-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yao-Cheng Wu ,  Hua-Kai Lin ,  Hao-Cheng Hou ,  Tsung-Ding Wang ,  Hao-Yi Tsai

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

Abstract: In an embodiment, a device includes: an interposer including: a back-side redistribution structure; an interconnection die over the back-side redistribution structure, the interconnection die including a substrate, a through-substrate via protruding from the substrate, and an isolation layer around the through-substrate via; a first encapsulant around the interconnection die, a surface of the first encapsulant being substantially coplanar with a surface of the isolation layer and a surface of the through-substrate via; and a front-side redistribution structure over the first encapsulant, the front-side redistribution structure including a first conductive via that physically contacts the through-substrate via, the isolation layer separating the first conductive via from the substrate.