公开(公告)号：US20240427081A1

公开(公告)日：2024-12-26

申请号：US18401851

申请日：2024-01-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Ning Weng ,  Yu-Ming Chou ,  Shih Wei Liang ,  Nien-Fang Wu ,  Jiun Yi Wu ,  Chen-Hua Yu

IPC: G02B6/122 ,  G02B6/136

Abstract: Optical devices and methods of manufacture are presented herein. In an embodiment, an optical device is provided that includes a first substrate, the first substrate including an optical device layer, and a semiconductor die, a first waveguide structure over the first substrate, the first waveguide structure including a first optical component surrounded by cladding material, wherein the first waveguide structure has a top surface, the top surface including a first portion at a first distance from the first substrate, a second portion at a second distance from the first substrate, and a transition portion between the first portion to the second portion, wherein the second distance is greater than the first distance, and a first reflective structure over the first portion and the transition portion, wherein a portion of the first reflective structure over the transition portion is a curved surface.

公开(公告)号：US20240264388A1

公开(公告)日：2024-08-08

申请号：US18164310

申请日：2023-02-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih Wei Liang ,  Yu-Ming Chou ,  Nien-Fang Wu ,  Jiun Yi Wu

IPC: G02B6/42 ,  H01L25/16

CPC classification number: G02B6/4214 ,  H01L25/167

Abstract: Package devices and methods of manufacture are discussed. In an embodiment, a method of manufacturing an integrated circuit device includes: forming an optical device layer; forming an optical layer on the optical device layer; after the forming the optical layer, forming a first opening in the optical layer; and embedding a reflective structure in the first opening.