公开(公告)号：US10784222B2

公开(公告)日：2020-09-22

申请号：US16176017

申请日：2018-10-31

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jung-Hua Chang ,  Jian-Yang He ,  Chin-Fu Kao

IPC: H01L23/488 ,  H01L23/00 ,  H01L21/78 ,  H01L25/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.

公开(公告)号：US20220336400A1

公开(公告)日：2022-10-20

申请号：US17232094

申请日：2021-04-15

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Tsung-Fu Tsai ,  Jian-Yang He ,  Ying-Ching Shih ,  Szu-Wei Lu

IPC: H01L23/00

Abstract: A structure including a substrate having a conductive pad and a connecting structure disposed on the conductive pad and electrically connected to the conductive pad. The connecting structure includes a first metallic layer disposed on the conductive pad, a first intermetallic compound layer disposed on the first metallic layer, a second intermetallic compound layer disposed on the first intermetallic compound layer and a second metallic layer disposed on the second intermetallic compound layer. The first metallic layer comprises copper. The first intermetallic compound layer comprises a first intermetallic compound. The second intermetallic compound layer comprises a second intermetallic compound different from the first intermetallic compound. The second metallic layer comprises tin. The first intermetallic compound contains copper, tin and one of nickel and cobalt.

公开(公告)号：US20200135677A1

公开(公告)日：2020-04-30

申请号：US16176017

申请日：2018-10-31

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jung-Hua Chang ,  Jian-Yang He ,  Chin-Fu Kao

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L25/00 ,  H01L23/31 ,  H01L25/10

Abstract: A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.