公开(公告)号：US20190140488A1

公开(公告)日：2019-05-09

申请号：US16220514

申请日：2018-12-14

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： MIN-JER WANG ,  CHING-NEN PENG ,  CHEWN-PU JOU ,  FENG WEI KUO ,  HAO CHEN ,  HUNG-CHIH LIN ,  HUAN-NENG CHEN ,  KUANG-KAI YEN ,  MING-CHIEH LIU ,  TSUNG-HSIUNG LEE

IPC分类号： H02J50/40 ,  H02J50/80 ,  G01R31/28 ,  H01L25/065 ,  H01L23/538 ,  H02J50/10 ,  G06F17/50 ,  H01L23/544 ,  G01R31/302 ,  H02J5/00 ,  H02J50/20

摘要： An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

公开(公告)号：US20210013748A1

公开(公告)日：2021-01-14

申请号：US17015602

申请日：2020-09-09

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： MIN-JER WANG ,  CHING-NEN PENG ,  CHEWN-PU JOU ,  FENG WEI KUO ,  HAO CHEN ,  HUNG-CHIH LIN ,  HUAN-NENG CHEN ,  KUANG-KAI YEN ,  MING-CHIEH LIU ,  TSUNG-HSIUNG LEE

IPC分类号： H02J50/40 ,  H01L25/065 ,  H01L23/538 ,  H02J50/10 ,  H02J50/80 ,  G01R31/28 ,  G01R31/302 ,  H01L23/544 ,  G06F30/39 ,  H02J50/20

摘要： An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.