公开(公告)号：US20220415773A1

公开(公告)日：2022-12-29

申请号：US17721499

申请日：2022-04-15

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Wen-Yi LIN ,  Kuang-Chun Lee ,  Chien-Chen Li ,  Chen-Shien Chen

IPC分类号： H01L23/498 ,  H01L21/48

摘要： A substrate for a semiconductor package includes an array of bonding pads on a first surface of the substrate, and a plurality of raised structures adjacent to at least some of the bonding pads on the first surface of the substrate. The raised structures may be configured to control the height of solder balls contacting the array of bonding pads when the package substrate is mounted onto a support substrate. The raised structures may compensate for a deformation of the package substrate so that the co-planarity of the solder balls may be improved, thereby providing an improved solder connection between the package substrate and the support substrate.